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mpxv7025g rev 0, 05/2005 freescale semiconductor technical data ? freescale semiconductor, inc., 2005. all rights reserved. integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and calibrated the mpxv7025g series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with a/d inputs. this patented, single element transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. features ? 5.0% maximum error over 0 to 85 c ? ideally suited for microprocessor or microcontroller-based systems ? temperature compensated over ?40 to +125 c ? thermoplastic (pps) surface mount package ? patented silicon shear stress strain gauge ? available in differential and gauge configurations typical applications ? respiratory systems ? process control ? patient monitoring ? remote monitoring devices figure 1. fully integrated pressure sensor schematic ordering information device type options case no. mpx series order no. packing options device marking small outline package (mpxv7025g series) ported elements gauge, axial port, smt 482a mpxv7025gc6u rails mpxv 7025 g gauge, axial port, smt 482a mpxv 7025 gc6t1 tape & reel mpxv 7025 g gauge, side port, smt 1369 mpxv 7025 gp trays mpxv 7025 g gauge, dual port, smt 1351 mpxv 7025 dp trays mpxv 7025 g small outline package pin numbers (1) 1. pins 1, 5, 6, 7, and 8 are internal device connections. do not connect to external circuitry or ground. pin 1 is noted by the notch in the lead. 1 n/c 5 n/c 2 v s 6 n/c 3 gnd 7 n/c 4 v out 8 n/c mpxv7025dp case 1351-01 mpxv7025gp case 1369-01 small outline package mpxv7025gc6u case 482a-01 mpxv7025g series integrated pressure sensor -25 to 25 kpa (-3.6 to 3.6 psi) 0.2 to 4.7 v output sensing element thin film temperature compensation and gain stage #1 gain stage #2 and ground reference shift circuitry v s v out gnd pins 1, 5, 6, 7, and 8 are no connects for small outline package device
mpxv7025g sensors 2 freescale semiconductor the mpxv7025g series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. media, other than dry air, may have adverse effects on sensor performance and long-term reliability. contact the factory for information regarding media compatibility in your application. table 1. maximum ratings (1) 1. exposure beyond the specified limits may cause permanent damage or degradation to the device. rating symbol value unit maximum pressure (p1 > p2) p max 200 kpa storage temperature t stg ?40 to +125 c operating temperature t a ?40 to +125 c table 2. operating characteristics ( v s = 5.0 vdc, t a = 25c unless otherwise noted, p1 > p2. decoupling circuit shown in figure 3 required to meet electrical specifications.) characteristic symbol min typ max unit pressure range (1) 1. 1.0 kpa (kilopascal) equals 0.145 psi. p op -25 ? 25 kpa supply voltage (2) 2. device is ratiometric within this specified excitation range. v s 4.75 5.0 5.25 vdc supply current i o ? 7.0 10 madc minimum pressure offset (3) (0 to 85 c) @ v s = 5.0 volts 3. offset (v off ) is defined as the output voltage at the minimum rated pressure. v off 0.116 0.25 0.384 vdc full scale output (4) (0 to 85 c) @ v s = 5.0 volts 4. full scale output (v fso ) is defined as the output voltage at the maximum or full rated pressure. v fso 4.610 4.75 4.890 vdc full scale span (5) (0 to 85 c) @ v s = 5.0 volts 5. full scale span (v fss ) is defined as the algebraic difference between the output vo ltage at full rated pressure and the output voltage at the minimum rated pressure. v fss ?4.5?vdc accuracy (6) (0 to 85 c) 6. accuracy (error budget) consists of the following: ? linearity: output deviation from a straight line relati onship with pressure over t he specified pressure range. ? temperature hysteresis: output deviation at any temperature within the operating temper ature range, after the temperature is cy cled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. ? pressure hysteresis: output deviation at any pressure within the specified range, when this pressu re is cycled to and from the minimum or maximum rated pressure at 25 c. ? tcspan: output deviation over the temperature range of 0 to 85 c, relative to 25 c. ? tcoffset: output deviation with minimum pressure applied, over the temperature range of 0 to 85 c, relative to 25 c. ? variation from nominal: t he variation from nominal values, for offse t or full scale span, as a percent of v fss at 25 c. ??? 5.0 %v fss sensitivity v/p ? 90 ?- mv/kpa response time (7) 7. response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when s ubjected to a specified step change in pressure. t r ?1.0?-ms output source current at full scale output i o+ ?0.1?-madc warm-up time (8) 8. warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. ??20?-ms offset stability (9) 9. offset stability is the product's output deviation when subjecte d to 1000 hours of pulsed pressure, temperature cycling with bias test. ?? 0.5 ?- %v fss
mpxv7025g sensors freescale semiconductor 3 figure 2 shows the sensor output signal relative to pressure input. typical, minimum, and maximum output curves are shown for operation over a temperature range of 0 to 85 c using the decoupling circuit shown in figure 3 . the output will saturate outside of the specified pressure range. figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the a/d input of a microprocessor or microcontroller. proper decoupling of the power supply is recommended. figure 2. output versus pressure differential figure 3. recommended power supply decoupling and output filtering (for additional output filtering, please refer to application note an1646.) differential pressure (kpa) output (v) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 025 transfer function: v out = v s *(0.018*p+0.5) error v s = 5.0 vdc temp = 0 to 85c typical min max -25 +5 v 1.0 f 0.01 f 470 pf gnd v s v out ips output
mpxv7025g sensors 4 freescale semiconductor nominal transfer value: v out = v s (p x 0.018 + 0.5) (pressure error x temp. factor x 0.018 x v s ) v s = 5.0 v 0.25 vdc transfer function mpxv7025g series temp multiplier ?40 3 0 to 85 1 +125 3 temperature in c 4.0 3.0 2.0 0.0 1.0 ?40 ?20 0 20 40 60 140 120 100 80 temperature error factor note: the temperature multiplier is a linear response from 0 to ?40c and from 85 to 125c. temperature error band pressure error (max) pressure error band -25 to 25 (kpa) 1.25 (kpa) error limits for pressure pressure (in kpa) 3.0 2.0 1.0 ?1.0 ?2.0 ?3.0 0.0 0 -25 pressure error (kpa) 25
mpxv7025g sensors freescale semiconductor 5 pressure (p1)/vacuum (p2) side identification table freescale designates the two sides of the pressure sensor as the pressure (p1) side and the vacuum (p2) side. the pressure (p1) side is the side containing fluorosilicone gel which protects the die from harsh media. the mpx pressure sensor is designed to operate with positive differential pressure applied, p1 > p2. the pressure (p1) side may be identified by using the table below: minimum recommended footprint for surface mounted applications surface mount board layout is a critical portion of the total design. the footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. with the correct footprint, the packages will self align when subjected to a solder reflow process. it is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. figure 4. small outline package footprint part number case type pressure (p1) side identifier mpx7025gc6u/c6t1 482a gauge, axial port, smt mpxv7025gp 1369 side with port attached mpxv7025dp 1351 side with part marking 0.660 16.76 0.060 typ 8x 1.52 0.100 typ 8x 2.54 0.100 typ 8x 2.54 0.300 7.62 inch mm scale 2:1
package dimensions mpxv7025g sensors 6 freescale semiconductor pin 1 identifier h seating plane -t- w c m j k v dim min max min max millimeters inches a 10.54 0.425 0.415 10.79 b 10.54 0.425 0.415 10.79 c 12.70 0.520 0.500 13.21 d 0.96 0.042 0.038 1.07 g 0.100 bsc 2.54 bsc h 0.002 0.010 0.05 0.25 j 0.009 0.011 0.23 0.28 k 0.061 0.071 1.55 1.80 m 0? 7? 0? 7? n 0.444 0.448 11.28 11.38 s 0.709 0.725 18.01 18.41 v 0.245 0.255 6.22 6.48 w 0.115 0.125 2.92 3.17 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006). 5. all vertical surfaces 5? typical draft. s d 8 pl g 4 5 8 1 s b m 0.25 (0.010) a t -a- -b- n s case 482a-01 issue a small outline package
package dimensions mpxv7025g sensors freescale semiconductor 7 notes: 1. 2. 3. 4. controlling dimension: inch. interpret dimensions and tolerances per asme y14.5m, 1994. dimensions "d" and "e1" do not include mold flash or protrusions. mold flash or protrusions shall not exceed 0.006 (0.152) per side. dimension "b" does not include dambar protrusion. allowable dambar protrusion shall be 0.008 (0.203) maximum. n a c 0.004 (0.1) detail g seating plane 8x p d e e/2 e a m 0.004 (0.1) b c e1 a b a 0.006 (0.15) b c 8x b 2 places 4 tips 1 4 8 5 f min max min max millimeters inches 0.370 0.390 9.39 9.91 0.002 0.010 0.05 0.25 0.038 0.042 0.96 1.07 0.465 0.485 11.81 12.32 0.680 0.700 17.27 17.78 0.465 0.485 11.81 12.32 0.270 0.290 6.86 7.37 0.160 0.180 4.06 4.57 0.009 0.011 0.23 0.28 0.110 0.130 2.79 3.30 0.100 bsc 2.54 bsc 0.240 0.260 6.10 6.60 0.115 0.135 2.92 3.43 0.040 0.060 1.02 1.52 0? 7? 0? 7? dim a a1 b d e e1 e m n p t f k l k m t ? gage plane detail g l a1 .014 (0.35) style 1: pin 1. gnd 2. +vout 3. vs 4. -vout 5. n/c 6. n/c 7. n/c 8. n/c style 2: pin 1. n/c 2. vs 3. gnd 4. vout 5. n/c 6. n/c 7. n/c 8. n/c case 1351-01 issue o small outline package
package dimensions mpxv7025g sensors 8 freescale semiconductor notes: 1. 2. 3. 4. controlling dimension: inch. interpret dimensions and tolerances per asme y14.5m, 1994. dimensions "d" and "e1" do not include mold flash or protrusions. mold flash or protrusions shall not exceed 0.006 (0.152) per side. dimension "b" does not include dambar protrusion. allowable dambar protrusion shall be 0.008 (0.203) maximum. n a c 0.004 (0.1) detail g seating plane 8x p t ? d e e/2 e a m 0.004 (0.1) b c e1 a b a 0.008 (0.20) b c 8x b 2 places 4 tips 1 4 8 5 f dim min max min max millimeters inches a 0.300 0.330 7.11 7.62 a1 0.002 0.010 0.05 0.25 b 0.038 0.042 0.96 1.07 d 0.465 0.485 11.81 12.32 e e1 0.465 0.485 11.81 12.32 e m 0.270 0.290 6.86 7.36 n 0.080 0.090 2.03 2.28 p 0.009 0.011 0.23 0.28 t 0.115 0.125 2.92 3.17 0.100 bsc 2.54 bsc f 0.245 0.255 6.22 6.47 k 0.120 0.130 3.05 3.30 l 0.061 0.071 1.55 1.80 0? 7? 0? 7? 0.717 bsc 18.21 bsc k m gage plane detail g l a1 .014 (0.35) case 1369-01 issue o small outline package
mpxv7025g sensors freescale semiconductor 9 notes
mpxv7025g sensors 10 freescale semiconductor notes
mpxv7025g sensors freescale semiconductor 11 notes
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